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| www..com EMIF02-MIC07F3 EMI filter and ESD protection Features EMI symmetrical (I/O) low-pass filter High efficiency in EMI/ESD protection Lead-free package Very thin package High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Lead-free Flip-Chip package (8 bumps) Complies with the following standards IEC 61000-4-2 level 4 (on external pins B1 and C1) - + 15 kV (air discharge) - + 8 kV (contact discharge) IEC 61000-4-2 level 1 (on external pins) - + 2 kV (air discharge) - + 2 kV (contact discharge) Figure 1. Pin configuration (bump side) 3 MIC Bias 2 Acc_Det 1 A Mic2p Op Gnd B C Applications Where EMI filtering in ESD sensitive equipment is required: On Gnd Mic2n Mobile phones and communication systems Computers, printers and MCU Boards Figure 2. Schematic GND Acc_Det Description The EMIF02-MIC07F3 chip is a highly integrated audio filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. B1 Mic2p Mic2n C1 GND C11 R31 A2 Mic Bias A3 R11 R21 GND C21 C31 B3 C32 to ASIC C3 C22 GND R22 R12 GND C12 GND GND B2 and C2 are ground bumps and must be connected together TM: IPAD is a trademark of STMicroelectronics. March 2010 Doc ID 17052 Rev 1 1/7 www.st.com 7 www..com Characteristics EMIF02-MIC07F3 1 Characteristics Table 1. Symbol Absolute ratings (limiting values) Parameter and test conditions Pins B1 and C1: ESD discharge IEC 61000-4-2, level 4 air discharge contact discharge Pins A2, A3, B3, C3: ESD discharge IEC 61000-4-2, level 1 air discharge contact discharge Power dissipation at Tamb = 25 C Operating temperature range Storage temperature range Value Unit VPP 15 8 kV 2 2 60 - 40 to + 85 - 55 to + 150 mW C C PD Top Tstg Figure 3. Symbol VBR VCL IRM VRM IF IPP IR VF Rd aT Electrical characteristics (definitions) Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Forward current Peak pulse current Breakdown current Forward voltage drop Dynamic impedance Voltage temperature = = = = = = = = = = Table 2. Symbol VBR IRM R11 R12 R21, R22 R31 C11, C12 Electrical characteristics - values (Tamb = 25 C) Test conditions IR = 1 mA VRM = 3 V per line 1900 800 1760 20 0.66 1 7 Min. 7 50 2000 1000 2200 25 0.83 1.25 8.75 200 2100 1200 2640 30 1 1.5 10.5 nF Typ. Max. Unit V nA Vline = 0 V, Vosc = 30 mV, F = 1 MHz C21, C22 (measured under zero light conditions and with bumps B2 and C2 connected together) C31, C32 2/7 Doc ID 17052 Rev 1 www..com EMIF02-MIC07F3 Characteristics Figure 4. -20 -25 -30 Attenuation versus frequency Figure 5. 0 Attenuation simulation with2 k input and 47 k ouput Input: 2 k Output: 47 k AC Simulations S21 (dB) VBIAS = 0 V S21 (dB) -10 -20 Mic2p -35 Mic2n -40 -45 -50 -55 -60 100k 1M 10M 100M 1G -30 -40 -50 -60 -70 -80 -90 F (Hz) -100 10 100 1k 10k 100k 1M 10M 100M 1G Figure 6. Analog crosstalk measurement Figure 7. ESD response to IEC 61000-4-2 on one input V(in) and on one output V(out) IN 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 Crosstalk (dB) VBIAS = 0 V -15 kV air discharge C2 5 V/Div 100 ns/Div C3 2 V/Div OUT F (Hz) 100k 1M 10M 100M 1G 100 ns/Div Figure 8. ESD response to IEC 61000-4-2 on one input V(in) and on one output V(out) Figure 9. Line capacitance versus applied voltage (C11) +15 kV air discharge 5 V/Div 1000 C (pF) 800 IN C2 100 ns/Div 2 V/Div OUT 600 400 200 C3 100 ns/Div 0 0 2 4 6 Vr (V) Doc ID 17052 Rev 1 3/7 www..com Ordering information scheme EMIF02-MIC07F3 2 Ordering information scheme Figure 10. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 3: Lead-free, pitch = 400 m yy - xxx zz Fx 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 11. Flip-Chip package dimensions 400 m 40 400 m 50 605 m 55 255 m 40 1.17 mm 30 m 4/7 Doc ID 17052 Rev 1 185 m 185 m 1.17 mm 30 m www..com EMIF02-MIC07F3 Ordering information Figure 12. Footprint recommendations Copper pad Diameter: 220m recommended 260m maximum Solder mask opening: 300m minimum Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil opening : 220m recommended xxz y ww Figure 14. Flip-Chip tape and reel specification 2.0 0.05 0.20 0.02 8.0 0.3 1.29 1.29 0.69 0.05 All dimensions in mm User direction of unreeling 4 Ordering information Table 3. Ordering information Marking JE Package Flip Chip Weight 1.8 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF02-MIC07F3 Note: More information is available in the application notes AN2348: "Flip Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" Doc ID 17052 Rev 1 3.5 - 0.05 STE STE STE xxz yww yww xxz yww xxz yww 1.75 0.1 4.0 0.1 O 1.55 0.05 5/7 www..com Revision history EMIF02-MIC07F3 5 Revision history Table 4. Date 16-Mar-2010 Document revision history Revision 1 Initial release. Changes 6/7 Doc ID 17052 Rev 1 www..com EMIF02-MIC07F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 17052 Rev 1 7/7 |
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